Copper Evaporation Pieces, Pellets and Shots

Cu, 99.9 – 99.999% pure


Copper Evaporation Materials are a very highly utilized evaporation material for thin film deposition processes. With their high purity and controlled evaporation rates they ensure precise film deposition onto substrates.

 

The most common Copper Evaporation Material shapes are pellets, granules, rod, wire, and starter sources.  We offer purities from 99.9% up to 99.999%.

 

Copper Evaporation Materials are crucial, possessing distinctive properties suited for various applications. Recognized for, facilitating uniform and defect-free film formation. Copper Evaporation Materials, with exceptional thermal conductivity and electrical conductivity,  play a vital role in industries requiring thin film fabrication, offering consistent performance and enabling technological advancements.

 

Copper Evaporation Materials are extensively used in semiconductor devices, integrated circuits, sensors, and electrical contacts. Additionally, they find applications in decorative coatings. It is known to be an excellent conductor of heat and electricity and can be found in wire, coins, and electromagnets. The vacuum industry relies heavily on copper material for backing plates which are bonded to sputtering targets.


Physical Properties

  Appearance                                             Copper, Metallic

   CAS#                                                         7440-50-8

   Melting Point                                          1,083oC

   Thermal Conductivity                          400W/m.K

   Coefficient of Thermal Expansion     16.5 x 10-6/K

   Theoretical Density                              8.92 gm/cm3

   Vapor Pressure                                      10-4 Torr at 1,017°C

   

Shots & Granules:   1 – 6 mm, 6 – 12 mm

Pellets & Cut Wire: 3 mm x 3 mm, 6 mm x 6 mm

 

Other sizes upon request

Safety Data Sheet (pdf)