Silicon Sputter Targets

Bayville Chemical offers Silicon Sputter Targets, Boron doped Silicon Sputter Targets and Silicon / Aluminum Sputter Targets for thin film and coating applications.

Specifications:

Silicon

Sputtering Method:      RF Sputtering            DC Sputtering

Purity:                             99% - 99.9999%         99.999% - 99.9999%

Dopant Content:           Undoped or                 Boron: 30 - 450 ppm

Resistivity:                      Doped                          0.002 - 0.05 Ohm cm

Crystal Structure:          Single or polycrystalline 

Silicon / Metal Composite

 Metal:                                  Al, (Ti, Cu, Ce, Y, La)

Metal Content:                   0.5 - 40 % wt.

Purity:                                  99% - 99.999%

         Aluminum is a standard, other metals upon request

Manufacturing Method:

Production of sputtering targets from Undoped or Boron doped Silicon includes CZ growth of ingots with annealing, material analysis, cutting and machining, polishing, certification and packaging. Silicon / Metal composite targets are manufactured by a variety of methods (casting, HIP, vacuum pressing), depending on the composition.

Backing Plates and Bonding:

We supply many standard OFHC Copper backing plates for commercially available sputtering and cathodic arc deposition systems, as well as custom designs. Both Metallic and Epoxy Bonding of Silicon tiles is available.