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Tantalum Sputtering Targets
Ta
Purities available: 99.9%, 99.95%, 99.99%
Applications: Tantalum is used as a substitute for platinum. Used in manufacturing super alloys and electron-beam melting. Tantalum is used in metallurgical, machinery processing, glass and ceramic industries. Tantalum is also used as a super alloy additive in nickel-based alloys. Used for sputtering targets in integrated circuits and Thin Film Transistor Liquid Crystal Display (TFT-LCD).
Specifications:
Material Type: Tantalum
Symbol: Ta
Atomic Weight: 180.94788
Atomic Number: 73
Color/Appearance: Gray Blue, Metallic
Thermal Conductivity: 57 W/m.K
Melting Point: 3,017°C
Coefficient of Thermal Expansion: 6.3 x 10-6/K
Theoretical Density: 16.6 g/cm3
Z Ratio: 0.262
Sputter: DC
Max Power Density: 100 W/in2
Type of Bonding: Indium, Elastomer
The ratings are based on unbonded targets and are material specific. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/Square Inch or lower, depending on the material.
Tantalum Sputtering Targets are available in various forms and shapes such as circular, rectangular, Mu and other forms upon request.
Round sputtering target:
Diameter: ≤ 8”, Thickness: ≥ 0.125”
Rectangular sputtering target:
Length: ≤ 32”, Width: ≤ 12”, Thickness: ≥ 0.04”
