Silicon – Aluminum Rotatable Sputter Targets

Si (90 wt%) / Al (10 wt%)

99.9% pure

Rotatable magnetron sputter deposition has become the most widely used coating technology for large area deposition. The glass industry has introduced advanced coating technologies as the demand for value-added products for the glass industry continues to grow. Magnetron sputtering is a vacuum coating process and one of the core methods for depositing thin films on glass. Rotatable targets offer lower cost of ownership through longer production runs, faster coating deposition and a more complete use of coating material.

SiO₂ and Si₃N₄ thin films are sputtered starting from SiAl targets. These thin films are extensively used in the automotive and architectural glass industry, conductive, scratch and glare resistant glass and video flat panel display glasses.

Composition:                                      90 wt% Silicon – 10 wt% Aluminum (+/- 2%

Process:                                              Plasma Spraying

Purity:                                                  99.9%

Theoretical Density:                          2.36 gm/cm³

Actual Density:                                   2.2 gm/cm³

Grain Size:                                           < 250 microns

Porosity:                                              < 0.5%

Straightness Tolerance:                   < 0.5 mm/Meter

Backing Tube:                                    Stainless Steel-304 tube

Maximum Outside Diameter:           200 mm

Maximum Length:                              4 meters

Typical Impurities:

Nitrogen                   < 5000 ppm

Iron                            < 300 ppm

Silicon                      < 150 ppm

Copper                    < 100 ppm

Nitrogen                  < 100 ppm

Zinc                          < 50 ppm

Titanium                  < 50 ppm